Hardware Developer 4

About the role

Job Description

The role is expected to protect manufacturing delivery, outgoing quality, and field reliability by using yield data, component failure trends, supplier quality signals, test coverage, factory inspection findings, RCCA discipline, and risk assessment to support OK-to-Ramp and OK-to-Ship decisions.

Key Responsibilities

Monitor factory quality performance across assigned products and sites, including IQC, OQC, L10/L11 yield, FPY, APY, retest rate, failure pareto, and test stability.

Use factory and component quality signals to identify open quality risks, containment gaps, unresolved issues, supplier exposure, and potential customer escape risks before products ramp or ship.

Drive factory issue containment, failure data review, RCCA follow-up, and corrective action validation with manufacturing partners, suppliers, and Oracle engineering teams.

Track component quality performance across assigned commodities, including supplier DPPM, RPM, AFR/RMA trends, failure pareto, PCN impact, material risk, and recurring factory or field failure modes.

Drive supplier and sub-tier RCCA for component failures found during factory integration, outgoing inspection, field returns, repair, or reliability testing.

Partner with component engineering, silicon engineering, supplier quality, sourcing, and repair teams to connect field failures back to factory outgoing quality and supplier corrective actions.

Ensure process escapes, rework risks, test instability, and recurring failure modes are documented, assigned to clear owners, and tracked to closure.

Review factory test coverage and confirm that known failure modes are detectable before shipment.

Validate that outgoing quality controls are effective in catching workmanship, configuration, labeling, packaging, cosmetic, documentation, and functional escapes.

Review supplier qualification data, reliability information, PCNs, material changes, alternate-source transitions, and factory incoming quality signals for risk to OCI hardware programs.

Partner with Manufacturing and Test teams to reduce yield gaps, debug churn, retest-driven instability, and recurring line failures.

Support NCAT, SSP, program readiness reviews, and executive quality updates with clear data, concise risk summaries, and recommended next actions.

Work frequently with Taiwan factory, process, test, and quality teams to confirm process controls, inspection criteria, rework instructions, escalation paths, and quality gates are in place.

Build and maintain factory quality risk registers for key programs, including containment status, RCCA owner, closure date, and residual risk.

Support OK-to-Ramp and OK-to-Ship decisions by making remaining quality risk clear, current, and actionable

Responsibilities

Required Skills and Experience

Experience in manufacturing quality, process quality, supplier quality, component quality, product quality, hardware quality, or reliability engineering.

Strong working knowledge of IQC, OQC, factory test flow, yield metrics, pareto analysis, retest rate, containment, and corrective action.

Working knowledge of component quality metrics such as DPPM, RPM, AFR, RMA, MTBF, supplier failure pareto, and corrective action effectiveness.

Experience using structured RCCA methods such as 8D, 5-Why, Fishbone, CAPA, or other disciplined problem-solving approaches.

Ability to analyze failure data, separate known issues from emerging risks, and drive fact-based closure with manufacturing partners, suppliers, and internal teams.

Ability to review supplier FA/RCCA quality, challenge weak problem statements, and ensure corrective actions are technically credible and validated.

Ability to work with incomplete data and still support sound quality decisions under ramp or shipment pressure.

Strong communication skills, including the ability to summarize technical issues, quality risk, and required actions for cross-functional teams.

Experience working with external manufacturers, suppliers, manufacturing engineering, test engineering, field teams, or repair teams.

Ability to work effectively across Taiwan manufacturing teams and global Oracle stakeholders in the U.S., Mexico, and other manufacturing regions.

Ability to bridge component-level issues into system-level factory quality decisions, including when a supplier issue should trigger containment, additional screening, retest, or ship-risk review.

Preferred Qualifications

Experience with server, rack-level, GPU, networking, storage, power, thermal, or other data center infrastructure products, especially cutting-edge AI infrastructure platforms.

Experience with component commodities such as GPUs, CPUs, memory, storage, networking, optics, cables, connectors, power supplies, PDUs, PCBs, fans, thermal components, or rack integration hardware.

Experience supporting NPI, production ramp, OK-to-Ramp, OK-to-Ship, stop-ship, containment, or customer-impacting quality reviews.

Familiarity with GRR, EST, RQT, test coverage validation, FMEA, control plans, SPC, DOE, or reliability qualification.

Experience with high-volume manufacturing partners, ODMs, CMs, EMs, repair operations, supplier factory audits, supplier qualification, PCN review, or component supplier management.

Experience working in Taiwan-based electronics manufacturing, system integration, rack integration, or server manufacturing environments.

Six Sigma, CQE, CRE, Lean, or equivalent quality and reliability training.

Qualifications

Career Level - IC4

About Us

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